Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11562983utility2023
Package Having Multiple Chips Integrated Therein and Manufacturing Method Thereof
0 cites
US11561482utility2023
Methods and Apparatus for Reducing Hydrogen Permeation from Lithographic Tool
0 cites
US11562118utility2023
Hard-to-fix (HTF) Design Rule Check (DRC) Violations Prediction
0 cites
US11562779utility2023
Bit Line Secondary Drive Circuit and Method
0 cites
US11562786utility2023
Memory Device Having a Negative Voltage Circuit
0 cites
US11562910utility2023
Semiconductor Structure and Method for Forming Thereof
0 cites
US11562923utility2023
Semiconductor Arrangement Including a First Electrical Insulator Layer and a Second Electrical Insulator Layer and Method of Making
0 cites
US11562935utility2023
Semiconductor Structure
0 cites
US11562941utility2023
Semiconductor Packages Having Thermal Conductive Patterns Surrounding the Semiconductor Die
0 cites
US11562953utility2023
Cell Having Stacked Pick-up Region
0 cites
US11562968utility2023
Apparatus for Lithographically Forming Wafer Identification Marks and Alignment Marks
0 cites
US11562982utility2023
Integrated Circuit Packages and Methods of Forming the Same
0 cites
US11562998utility2023
Capacitor and Method for Forming the Same
0 cites
US11563006utility2023
Semiconductor Structure and Method for Manufacturing Thereof
0 cites
US11563014utility2023
Memory Devices and Methods of Manufacturing Thereof
0 cites
US11563048utility2023
Semiconductor Device and Method of Manufacturing the Same
0 cites
US11563079utility2023
Metal Insulator Metal (MIM) Structure and Manufacturing Method Thereof
0 cites
US11563109utility2023
Semiconductor Device Structure and Method for Forming the Same
0 cites
US11563095utility2023
Silicide-sandwiched Source/drain Region and Method of Fabricating Same
0 cites
US11563099utility2023
Semiconductor Structure
0 cites

← PreviousPage 406 of 411Next →