Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11569105utility2023
Multi-flip Semiconductor Die Sorter Tool
0 cites
US11569124utility2023
Interconnect Structure Having an Etch Stop Layer Over Conductive Lines
0 cites
US11569130utility2023
Fin Field Effect Transistor (finfet) Device Structure with Dummy Fin Structure
0 cites
US11569164utility2023
Semiconductor Device with Polygonal Inductive Device
0 cites
US11569147utility2023
Method of Forming Semiconductor Package with Composite Thermal Interface Material Structure
0 cites
US11569166utility2023
Semiconductor Device and Manufacturing Method Thereof
0 cites
US11569167utility2023
Method of Manufacturing Semiconductor Device
0 cites
US11569168utility2023
Integrated Circuit, System and Method of Forming the Same
0 cites
US11569183utility2023
Package Structure and Method of Fabricating the Same
0 cites
US11569190utility2023
Semiconductor Structure and Manufacturing Method Thereof
0 cites
US11569202utility2023
Semiconductor Device, Circuit Board Structure and Manufacturing Method Thereof
0 cites
US11569289utility2023
Image Sensor Having Stress Releasing Structure and Method of Forming Same
0 cites
US11569230utility2023
Method and Structure for Finfet Devices
0 cites
US11569236utility2023
Replacement Gate Process for Finfet
0 cites
US11569249utility2023
Anti-fuse Device Method and Layout
0 cites
US11569246utility2023
Four CPP Wide Memory Cell with Buried Power Grid, and Method of Fabricating Same
0 cites
US11569247utility2023
Semiconductor Structure
0 cites
US11569251utility2023
High Voltage Polysilicon Gate in High-k Metal Gate Device
0 cites
US11569264utility2023
3D RAM SL/BL Contact Modulation
0 cites
US11569288utility2023
Image Sensor Having Stress Releasing Structure and Method of Forming Same
0 cites

← PreviousPage 404 of 411Next →