Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11574110utility2023
Method of Forming an Integrated Circuit
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US11574657utility2023
Memory Device, Sense Amplifier and Method for Mismatch Compensation
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US11574658utility2023
Memory Device with Charge-recycling Arrangement
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US11574676utility2023
Structure for Multiple Sense Amplifiers of Memory Device
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US11574847utility2023
Seal Ring Between Interconnected Chips Mounted on an Integrated Circuit
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US11574857utility2023
Semiconductor Package and Manufacturing Method Thereof
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US11574872utility2023
Package Structure and Method of Manufacturing the Same
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US11574861utility2023
Semiconductor Package
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US11574865utility2023
Method of Forming Semiconductor Device Including Deep Vias
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US11574878utility2023
Semiconductor Structure and Manufacturing Method Thereof
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US11574882utility2023
Pad Structure and Manufacturing Method Thereof in Semiconductor Device
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US11574886utility2023
Thermally Conductive Molding Compound Structure for Heat Dissipation in Semiconductor Packages
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US11574900utility2023
Integrated Circuit Device and Method
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US11574901utility2023
Semiconductor Device and Method for Manufacturing the Same
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US11574909utility2023
Semiconductor Device, Method for Manufacturing the Same, and Integrated Circuit
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US11574917utility2023
Method of Forming Memory Device
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US11574927utility2023
Semiconductor Devices and Method for Manufacturing the Same
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US11574928utility2023
Semiconductor Memory Structure and Method for Forming the Same
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US11574929utility2023
3D Ferroelectric Memory
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US11574940utility2023
Metal-insulator-metal Capacitor Structure to Increase Capacitance Density
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