Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11587863utility2023
Semiconductor Structure and Method of Forming Semiconductor Package
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US11587872utility2023
Interconnect Structure for Improving Memory Performance And/or Logic Performance
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US11587875utility2023
Connecting Structure and Method for Forming the Same
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US11587886utility2023
Semiconductor Device
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US11587887utility2023
Semiconductor Device and Manufacturing Method Thereof
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US11587894utility2023
Package and Method of Fabricating the Same
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US11587900utility2023
Package Structure Including IPD and Method of Forming the Same
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US11587902utility2023
Semiconductor Structure and Method of Forming the Same
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US11587907utility2023
Package Structure
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US11587908utility2023
3DIC Structure and Methods of Forming
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US11587910utility2023
Stacked Semiconductor Structure and Method
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US11587916utility2023
Package Structure and Manufacturing Method Thereof
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US11587922utility2023
Process Control for Package Formation
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US11587926utility2023
Semiconductor Structure
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US11587950utility2023
Memory Device and Method of Forming the Same
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US11588018utility2023
Semiconductor Device Structure with Nanostructure and Method for Forming the Same
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US11588020utility2023
Semiconductor Device and Method for Manufacturing the Same
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US11588031utility2023
Semiconductor Structure for Memory Device and Method for Forming the Same
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US11588028utility2023
Shielding Structure for Ultra-high Voltage Semiconductor Devices
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US11588095utility2023
Piezoelectric Biosensor and Related Method of Formation
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