Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11640962utility2023
Semiconductor Structure
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US11640978utility2023
Low-k Feature Formation Processes and Structures Formed Thereby
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US11640989utility2023
Semiconductor Device Structure with Metal Gate Stack
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US11637084utility2023
Semiconductor Package Having a Through Intervia Through the Molding Compound and Fan-out Redistribution Layers Disposed Over the Respective Die of the Stacked Fan-out System-in-package
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US11634318utility2023
Mems Using Outgassing Material to Adjust the Pressure Level in a Cavity
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US11635347utility2023
System for Reducing Friction-induced Wear of Pipe
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US11635643utility2023
Waveguide Structure and Method for Forming the Same
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US11636248utility2023
Metal Cut Region Location System
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US11636896utility2023
Memory Cell Array Circuit and Method of Forming the Same
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US11636884utility2023
Back-up and Restoration of Register Data
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US11637010utility2023
System and Method of Forming a Porous Low-k Structure
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US11637054utility2023
Semiconductor Package and Method of Manufacturing the Same
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US11637062utility2023
Interconnect Structure and Method for Manufacturing the Interconnect Structure
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US11637066utility2023
Integrated Circuit and Method for Forming the Same
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US11637069utility2023
Semiconductor Device with V2V Rail and Methods of Making Same
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US11637072utility2023
Semiconductor Package and Method of Manufacturing the Same
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US11637086utility2023
Sawing Underfill in Packaging Processes
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US11637101utility2023
Semiconductor Device and Manufacturing Method Thereof
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US11637097utility2023
Method of Manufacturing Package Structure
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US11637108utility2023
Memory Array Circuit and Method of Manufacturing Same
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