Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11658143utility2023
Bump-on-trace Design for Enlarge Bump-to-trace Distance
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US11658150utility2023
System on Integrated Chips and Methods of Forming Same
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US11658153utility2023
Forming Recesses in Molding Compound of Wafer to Reduce Stress
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US11658157utility2023
Integrated Circuit Including a First Semiconductor Wafer and a Second Semiconductor Wafer, Semiconductor Device Including a First Semiconductor Wafer and a Second Semiconductor Wafer and Method of Manufacturing Same
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US11658158utility2023
Die to Die Interface Circuit
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US11658164utility2023
Electronics Card Including Multi-chip Module
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US11658172utility2023
Hybrid Bonding with Through Substrate via (TSV)
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US11658182utility2023
Integrated Circuit Device with High Mobility and System of Forming the Integrated Circuit
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US11658206utility2023
Deep Trench Structure for a Capacitive Device
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US11658215utility2023
Method of Forming Contact Structures
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US11658216utility2023
Method and Structure for Metal Gate Boundary Isolation
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US11658220utility2023
Drain Side Recess for Back-side Power Rail Device
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US11658224utility2023
Split Gate Memory Device and Method of Fabricating the Same
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US11658225utility2023
Fin Field-effect Transistor and Method of Forming the Same
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US11658226utility2023
Backside Gate Contact
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US11658230utility2023
Method for Forming a Semiconductor Structure Including Plasma Cleaning Operations
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US11652054utility2023
Dielectric on Wire Structure to Increase Processing Window for Overlying Via
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US11649162utility2023
Particle Filter for MEMS Device
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US11650500utility2023
Photoresist and Method of Formation and Use
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US11650512utility2023
Reticle Cleaning Device and Method of Use
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