Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11669671utility2023
Semiconductor Device Including Pg-aligned Cells and Method of Generating Layout of Same
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US11669957utility2023
Semiconductor Wafer Measurement Method and System
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US11670362utility2023
Sub-word Line Driver Placement for Memory Device
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US11670365utility2023
Circuitry for Power Management Assertion
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US11670500utility2023
Treatment System and Method
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US11670501utility2023
Semiconductor Device Structure with Resistive Elements
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US11670519utility2023
Redistribution Structures for Semiconductor Packages and Methods of Forming the Same
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US11670539utility2023
Method of Making a Semiconductor Arrangement
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US11670541utility2023
Methods of Manufacturing Semiconductor Device Using Phase Shift Mask
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US11670544utility2023
Via-first Process for Connecting a Contact and a Gate Electrode
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US11670546utility2023
Semiconductor Structure and Manufacturing Method Thereof
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US11670547utility2023
Semiconductor Arrangement and Method of Making
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US11670552utility2023
Methods for Forming Fin Field-effect Transistors
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US11670575utility2023
Package Structure, RDL Structure Comprising Redistribution Layer Having Ground Plates and Signal Lines
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US11670577utility2023
Chip Package with Redistribution Structure Having Multiple Chips
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US11670579utility2023
Semiconductor Structure and Method of Manufacturing the Same
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US11670581utility2023
Interconnect Structure
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US11670582utility2023
Package Structure and Method of Fabricating the Same
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US11670584utility2023
Semiconductor Structure with Ultra Thick Metal and Manufacturing Method Thereof
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US11670590utility2023
Chip Structure with Etch Stop Layer and Method for Forming the Same
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