Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11681853utility2023
Integrated Circuit and Method of Forming Same and a System
0 cites
US11682433utility2023
Multiple Stack High Voltage Circuit for Memory
0 cites
US11682434utility2023
Low Power Scheme for Power Down in Integrated Dual Rail Srams
0 cites
US11682450utility2023
SRAM Performance Optimization via Transistor Width and Threshold Voltage Tuning
0 cites
US11682551utility2023
Wafer Structure and Trimming Method Thereof
0 cites
US11682580utility2023
Interconnect Structure and Method of Forming the Same
0 cites
US11682583utility2023
Through-vias and Methods of Forming the Same
0 cites
US11682589utility2023
CMOS Finfet Structures Including Work-function Materials Having Different Proportions of Crystalline Orientations and Methods of Forming the Same
0 cites
US11682593utility2023
Interposer Test Structures and Methods
0 cites
US11682594utility2023
Semiconductor Structure Including Interconnection to Probe Pad with Probe Mark
0 cites
US11682616utility2023
Semiconductor Structure and Method for Forming the Same
0 cites
US11682618utility2023
Hybrid Metal Line Structure
0 cites
US11682619utility2023
Package Component, Semiconductor Package and Manufacturing Method Thereof
0 cites
US11682624utility2023
Method of Forming an Interconnect Structure Having an Air Gap and Structure Thereof
0 cites
US11682629utility2023
Package Structure and Manufacturing Method Thereof
0 cites
US11682636utility2023
Info Structure and Method Forming Same
0 cites
US11682637utility2023
Air Channel Formation in Packaging Process
0 cites
US11682638utility2023
Semiconductor Structure Having Multiple Dielectric Waveguide Channels and Method for Forming Semiconductor Structure
0 cites
US11682645utility2023
Plurality of Stacked Pillar Portions on a Semiconductor Structure
0 cites
US11682647utility2023
Semiconductor Package and Method for Manufacturing the Same
0 cites

← PreviousPage 371 of 411Next →