- US11694926utility2023Barrier Free Interface Between Beol Interconnects0 cites
- US11694927utility2023Formation Method of Semiconductor Device with Contact Structures0 cites
- US11694939utility2023Semiconductor Package, Integrated Optical Communication System0 cites
- US11694941utility2023Semiconductor Die Package with Multi-lid Structures and Method for Forming the Same0 cites
- US11694943utility2023Semiconductor Device Including Heat Dissipation Structure and Fabricating Method of the Same0 cites
- US11694956utility2023Semiconductor Circuit for Memory Device and Method of Manufacturing the Same0 cites
- US11694966utility2023Chip Package and Method of Forming the Same0 cites
- US11694967utility2023Package Structure and Method of Fabricating the Same0 cites
- US11694974utility2023Semiconductor Die with Warpage Release Layer Structure in Package and Fabricating Method Thereof0 cites
- US11694975utility2023Chip Package Structure0 cites
- US11694979utility2023Isolation Structure for Bond Pad Structure0 cites
- US11694997utility2023Backside Contact for Thermal Displacement in a Multi-wafer Stacked Integrated Circuit0 cites
- US11695007utility2023Guard Ring Capacitor Method and Structure0 cites
- US11695061utility2023Finfets with Low Source/drain Contact Resistance0 cites
- US11695063utility2023Method of Forming Shaped Source/drain Epitaxial Layers of a Semiconductor Device0 cites
- US11695082utility2023Non-volatile Memory Cell and Non-volatile Memory0 cites
- US11695150utility2023Semiconductor Structures Having a Micro-battery and Methods for Making the Same0 cites
- US11695414utility2023Multi-gated I/O System, Semiconductor Device Including and Method for Generating Gating Signals for Same0 cites
- US11695416utility2023Level Shifter0 cites