Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11749720utility2023
Integrated Circuit Structure and Method with Solid Phase Diffusion
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US11749719utility2023
Source/drain Features
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US11749718utility2023
Semiconductor Device and Manufacturing Method Thereof
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US11749711utility2023
Semiconductor Device Structure with Magnetic Element
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US11749677utility2023
Semiconductor Structure and Methods of Forming the Same
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US11749651utility2023
Semiconductor Package and Manufacturing Method Thereof
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US11749643utility2023
Semiconductor Packages and Methods for Forming the Same
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US11749664utility2023
Memory Circuits
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US11749640utility2023
Semiconductor Package and Method of Manufacturing the Same
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US11749626utility2023
Integrated Devices in Semiconductor Packages and Methods of Forming Same
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US11749623utility2023
Semiconductor Memory Devices and Methods of Manufacturing Thereof
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US11749617utility2023
Package Structure and Method for Fabricating the Same
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US11749607utility2023
Package and Method of Manufacturing the Same
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US11749604utility2023
Ruthenium Oxide Film and Ruthenium Liner for Low-resistance Copper Interconnects in a Device
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US11749594utility2023
Semiconductor Structure and Manufacturing Method Thereof
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US11742254utility2023
Sensor Package and Method
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US11742238utility2023
Dielectric Gap-filling Process for Semiconductor Device
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US11742220utility2023
Integrated Passive Device Package and Methods of Forming Same
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US11742219utility2023
Integrated Fan-out Package and Manufacturing Method Thereof
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US11742218utility2023
Semiconductor Device Package Having Metal Thermal Interface Material and Method for Forming the Same
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