- US11791006utility2023Non-volatile Memory Circuit0 cites
- US11791192utility2023Workpiece Holder, Wafer Chuck, Wafer Holding Method0 cites
- US11791205utility2023Protection Structures for Bonded Wafers0 cites
- US11791214utility2023Gate-all-around Semiconductor Device and Method0 cites
- US11791215utility2023Fin Field Effect Transistor Device Structure0 cites
- US11791241utility2023Front-to-back Bonding with Through-substrate via (TSV)0 cites
- US11791243utility2023Semiconductor Device and Method of Manufacture0 cites
- US11791246utility2023Package Structure with Photonic Die and Method0 cites
- US11791291utility2023Multiplexer Cell and Semiconductor Device Having Camouflage Design, and Method for Forming Multiplexer Cell0 cites
- US11791301utility2023Chip Package Structure0 cites
- US11791313utility2023Semiconductor Package and Method of Forming the Same0 cites
- US11791329utility2023ESD Protection Circuit, Semiconductor System Including Same, and Method for Operating Same0 cites
- US11791333utility2023Three-dimensional Integrated Circuit Structures and Method of Forming the Same0 cites
- US11791356utility2023Image Sensor Device Having a First Lens and a Second Lens Over the First Lens0 cites
- US11791357utility2023Composite BSI Structure and Method of Manufacturing the Same0 cites
- US11791361utility2023Image Sensor with Overlap of Backside Trench Isolation Structure and Vertical Transfer Gate0 cites
- US11791371utility2023Resistor Structure0 cites
- US11791387utility2023Semiconductor Devices with Backside via and Methods Thereof0 cites
- US11791388utility2023Source Leakage Current Suppression by Source Surrounding Gate Structure0 cites
- US11791393utility2023Semiconductor Device and Method of Forming the Same0 cites