Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11810830utility2023
Chip Package Structure with Cavity in Interposer
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US11804457utility2023
Package Structure and Manufacturing Method Thereof
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US11805662utility2023
Memory Devices with Selector Layer and Methods of Forming the Same
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US11805661utility2023
Semiconductor Device and Manufacturing Method Thereof
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US11805658utility2023
Magnetic Random Access Memory and Manufacturing Method Thereof
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US11805652utility2023
3D RAM SL/BL Contact Modulation
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US11804548utility2023
Semiconductor Structure and Method for Forming the Same
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US11804546utility2023
Structure and Method for Integrated Circuit
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US11804538utility2023
Method of Forming a High Electron Mobility Transistor
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US11804534utility2023
Semiconductor Device and Manufacturing Method Thereof
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US11804489utility2023
Semiconductor Device and Manufacturing Method Thereof
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US11804488utility2023
Semiconductor Device and Method
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US11804485utility2023
Semiconductor Devices and Methods of Manufacture
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US11804482utility2023
Transistor Drain Design for ESD Protection and Manufacturing Method Thereof
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US11804473utility2023
Hybrid Bond Pad Structure
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US11804468utility2023
Manufacturing Method of Semiconductor Package Using Jig
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US11804451utility2023
Package Structure and Method of Fabricating the Same
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US11804445utility2023
Method for Forming Chip Package Structure
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US11804443utility2023
Segregated Power and Ground Design for Yield Improvement
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US11804433utility2023
Semiconductor Package Structure and Method for Forming the Same
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