Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11823955utility2023
Multi-layered Insulating Film Stack
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US11823957utility2023
Method of Manufacturing a Semiconductor Device and a Semiconductor Device
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US11823958utility2023
Semiconductor Device and Method
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US11823959utility2023
FUSI Gated Device Formation
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US11823960utility2023
Method for Forming Semiconductor Structure with High Aspect Ratio
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US11823979utility2023
Method of Forming Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via
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US11823980utility2023
Package Structure and Manufacturing Method Thereof
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US11823981utility2023
Semiconductor Package and Manufacturing Method Thereof
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US11824005utility2023
Package Structure with Reinforcement Structures in a Redistribution Circuit Structure and Manufacturing Method Thereof
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US11823991utility2023
Frames Stacked on Substrate Encircling Devices and Manufacturing Method Thereof
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US11825651utility2023
Semiconductor Device and Manufacturing Method Thereof
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US11825753utility2023
Memory Cell, Integrated Circuit, and Manufacturing Method of Memory Cell
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US11824541utility2023
Flip Flop Standard Cell
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US11824058utility2023
Method of Forming Semiconductor Device
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US11824021utility2023
Semiconductor Package for High-speed Data Transmission and Manufacturing Method Thereof
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US11824103utility2023
Method of Manufacturing a Semiconductor Device and a Semiconductor Device
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US11824027utility2023
Semiconductor Package
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US11824073utility2023
Image Sensor Device
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US11824088utility2023
Method for Forming Multi-gate Semiconductor Device
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US11824538utility2023
Multi-bit Flip Flop
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