Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11849589utility2023
Semiconductor Structure and Manufacturing Method Thereof
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US11849587utility2023
Three-dimensional Memory Device and Manufacturing Method Thereof
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US11846881utility2023
EUV Photomask
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US11849574utility2023
Layout Structure of Storage Cell and Manufacturing Method Thereof
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US11848554utility2023
Electrostatic Discharge Circuit and Method of Operating Same
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US11848381utility2023
Methods of Operating Multi-bit Memory Storage Device
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US11848373utility2023
Semiconductor Devices and Methods of Manufacture
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US11848370utility2023
Semiconductor Device and Manufacturing Method for the Semiconductor Device
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US11842994utility2023
Semiconductor Device Having Staggered Gate-stub-size Profile and Method of Manufacturing Same
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US11842983utility2023
Semiconductor Structure
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US11842966utility2023
Integrated Chip with Inter-wire Cavities
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US11842963utility2023
Semiconductor Device and Method
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US11842962utility2023
Interconnect Structure with Air-gaps
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US11842955utility2023
Method of Making an Integrated Circuit Package Including an Integrated Circuit Die Soldered to a Bond Pad of a Redistribution Structure
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US11841625utility2023
Device and Method to Remove Debris from an Extreme Ultraviolet (EUV) Lithography System
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US11842936utility2023
Underfill Structure for Semiconductor Packages and Methods of Forming the Same
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US11842930utility2023
Gap Patterning for Metal-to-source/drain Plugs in a Semiconductor Device
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US11842929utility2023
Semiconductor Devices and Methods of Manufacturing Thereof
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US11842927utility2023
Semiconductor Structure
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US11842924utility2023
Dual Etch-stop Layer Structure
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