Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11901361utility2024
Semiconductor Structure and Method for Forming the Same
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US11901353utility2024
Integrated Circuits Including Coil Circuit and SCR
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US11901352utility2024
Dual-port SRAM Structure
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US11901349utility2024
Semiconductor Packages and Methods for Forming the Same
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US11901323utility2024
Semiconductor Packages Having Conductive Pillars with Inclined Surfaces
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US11901320utility2024
Contact Pad for Semiconductor Device
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US11901319utility2024
Semiconductor Package System and Method
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US11901306utility2024
Semiconductor Structure
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US11901303utility2024
Integrated Fan-out Package
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US11901302utility2024
Info-pop Structures with Tivs Having Cavities
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US11901289utility2024
Semiconductor Device Structure with Resistive Element
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US11901286utility2024
Diagonal via Pattern and Method
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US11901283utility2024
Capacitor and Method for Forming the Same
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US11901279utility2024
Semiconductor Package and Method of Manufacturing the Same
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US11901277utility2024
Semiconductor Package and Method of Manufacturing the Same
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US11901266utility2024
Semiconductor Device Structure and Method for Forming the Same
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US11901263utility2024
Semiconductor Device and Manufacturing Method Thereof
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US11901256utility2024
Semiconductor Device, Semiconductor Package, and Methods of Manufacturing the Same
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US11901255utility2024
Semiconductor Device and Method of Forming the Same
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US11901258utility2024
Iintegrated Fan-out Packages with Embedded Heat Dissipation Structure
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