Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11908794utility2024
Protection Liner on Interconnect Wire to Enlarge Processing Window for Overlying Interconnect Via
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US11908790utility2024
Chip Structure with Conductive via Structure and Method for Forming the Same
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US11908789utility2024
Selective Formation of Conductor Nanowires
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US11908864utility2024
Method of Manufacturing Semiconductor Devices and a Semiconductor Device
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US11908788utility2024
3D IC Decoupling Capacitor Structure and Method for Manufacturing the Same
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US11908787utility2024
Package Structure and Method of Manufacturing the Same
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US11908764utility2024
Semiconductor Package Including a Circuit Substrate Having a Cavity and a Floor Plate Embedded in a Dielectric Material and a Semiconductor Die Disposed in the Cavity
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US11908754utility2024
Method and System for Controlling Profile of Critical Dimension
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US11908765utility2024
Semiconductor Structure with Heating Element
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US11908750utility2024
Semiconductor Device and Method
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US11908749utility2024
Method of Metal Gate Formation and Structures Formed by the Same
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US11908746utility2024
Semiconductor Devices and Methods of Manufacturing Thereof
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US11908745utility2024
Semiconductor Device with Non-conformal Gate Dieletric Layers
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US11908878utility2024
Image Sensor and Manufacturing Method Thereof
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US11908744utility2024
Semiconductor Device Structure
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US11908740utility2024
Semiconductor Structure with Doped via Plug
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US11908706utility2024
Cross-wafer Rdls in Constructed Wafers
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US11908701utility2024
Patterning Method and Manufacturing Method of Semiconductor Device
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US11908700utility2024
Method for Manufacturing Semiconductor Structure
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US11908695utility2024
Replacement Gate Methods That Include Treating Spacers to Widen Gate
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