Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11915954utility2024
Multi-flip Semiconductor Die Sorter Tool
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US11915957utility2024
Multiple Semiconductor Die Container Load Port
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US11915958utility2024
Apparatus and Method for Automated Wafer Carrier Handling
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US11915976utility2024
Semiconductor Device Pre-cleaning
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US11915977utility2024
Interconnect Structure for Stacked Device
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US11915979utility2024
Gate Structures in Semiconductor Devices
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US11915991utility2024
Semiconductor Device Having First Heat Spreader and Second Heat Spreader and Manufacturing Method Thereof
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US11915992utility2024
Method for Forming Package Structure with Lid
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US11915994utility2024
Package Structure Comprising a Semiconductor Die with a Thermoelectric Structure and Manufacturing Method Thereof
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US11916009utility2024
Semiconductor Package and Manufacturing Method Thereof
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US11916012utility2024
Manufacturing Method of Semiconductor Structure
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US11916017utility2024
Signal Conducting Line Arrangements in Integrated Circuits
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US11916022utility2024
Photolithography Alignment Process for Bonded Wafers
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US11916023utility2024
Thermal Interface Material Having Different Thicknesses in Packages
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US11916028utility2024
Package Structure and Method of Forming the Same
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US11916031utility2024
Semiconductor Device and Method of Manufacturing
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US11916037utility2024
Method for Bonding Semiconductor Devices, Method for Forming Semiconductor Structure and System for Performing the Method
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US11916043utility2024
Multi-wafer Integration
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US11916060utility2024
Semiconductor Device Having Improved Electrostatic Discharge Protection
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US11916070utility2024
Semiconductor Structure with Nanosheets
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