Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11929321utility2024
Method for Forming via Structure Having Low Interface Resistance
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US11923353utility2024
LTHC as Charging Barrier in Info Package Formation
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US11923357utility2024
Semiconductor Device Structure and Methods of Forming the Same
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US11923359utility2024
Method for Forming Fin Field Effect Transistor (finfet) Device Structure
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US11923360utility2024
Semiconductor Device and Method for Forming the Same
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US11923203utility2024
Semiconductor Device and Method of Manufacturing Semiconductor Device
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US11923413utility2024
Semiconductor Structure with Extended Contact Structure
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US11921434utility2024
Mask Cleaning
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US11922108utility2024
Method of Forming a Memory Cell Array Circuit
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US11923352utility2024
Semiconductor Device with Capacitor and Method for Forming the Same
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US11923338utility2024
Stacked Integrated Circuits with Redistribution Lines
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US11923349utility2024
Semiconductor Structures
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US11923326utility2024
Bump Structure and Method of Manufacturing Bump Structure
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US11923318utility2024
Method of Manufacturing Semiconductor Package
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US11923315utility2024
Semiconductor Package and Manufacturing Method Thereof
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US11923310utility2024
Package Structure Including Through via Structures
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US11923306utility2024
Semiconductor Structure Having Air Gaps and Method for Manufacturing the Same
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US11923304utility2024
Electro-migration Barrier for Interconnect
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US11923301utility2024
Method of Manufacturing Semiconductor Device
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US11923300utility2024
Two-dimensional (2D) Metal Structure
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