Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12538567utility2026
Semiconductor Structure
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US12538814utility2026
Semiconductor Structure with a Bridge Embedded Therein and Method Manufacturing the Same
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US12538816utility2026
Package Structure Having Line Connected via Portions
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US12538808utility2026
Die and Package Structure
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US12538826utility2026
Semiconductor Device and Method of Manufacturing the Same
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US12538782utility2026
Semiconductor Device Including Recessed Interconnect Structure
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US12538791utility2026
Source/drain Contact for Semiconductor Device Structure
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US12538827utility2026
Semiconductor Structure
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US12538793utility2026
Metal Insulator Metal Capacitor Structure and Method of Manufacturing the Same
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US12538773utility2026
Semiconductor Structure Having Self-aligned Conductive Structure and Method for Forming the Semiconductor Structure
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US12538533utility2026
Semiconductor Device Structure and Method for Forming the Same
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US12538771utility2026
Barrier Layer for an Interconnect Structure
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US12538776utility2026
Methods for Selectively Removing Material
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US12538851utility2026
Memory Packages and Methods of Forming Same
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US12538746utility2026
Apparatus and Methods for Determining Wafer Characters
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US12538777utility2026
Fin Field Effect Transistor (finfet) Having Hourglass-shaped via Structure on Source/drain and Method for Forming the Same
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US12538760utility2026
Method of Manufacturing a Semiconductor Device
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US12538548utility2026
Method of Manufacturing a Semiconductor Device and a Semiconductor Device
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US12538580utility2026
Semiconductor Structure Having Different Heights of Active Regions
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US12538596utility2026
Sensor Device and Method for Forming the Same
0 cites

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