Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11932534utility2024
MEMS Device Having a Metallization Structure Embedded in a Dielectric Structure with Laterally Offset Sidewalls of a First Portion and a Second Portion
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US11932531utility2024
Curved Cantilever Design to Reduce Stress in MEMS Actuator
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US11935757utility2024
Method of Manufacturing a Semiconductor Device
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US11935728utility2024
Apparatus and Method of Manufacturing a Semiconductor Device
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US11935760utility2024
Package Structure Having Thermal Dissipation Structure Therein and Manufacturing Method Thereof
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US11935769utility2024
Interlock Apparatus for Chemical Supply System
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US11935921utility2024
Dielectric Structures for Semiconductor Devices
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US11935918utility2024
High Voltage Device with Boosted Breakdown Voltage
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US11935895utility2024
Semiconductor Device Structure and Methods of Forming the Same
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US11935893utility2024
Semiconductor Device Including Standard Cells
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US11935889utility2024
Fin Structure and Method of Forming Same Through Two-step Etching Processes
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US11935888utility2024
Integrated Circuit Having Fins Crossing Cell Boundary
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US11935882utility2024
Static Random Access Memory Device
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US11935786utility2024
Contact Features of Semiconductor Devices
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US11935871utility2024
Semiconductor Package and Method of Fabricating the Same
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US11935866utility2024
Semiconductor Device Having Reduced Bump Height Variation
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US11935842utility2024
Methods of Manufacturing an Integrated Circuit Having Stress Tuning Layer
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US11935837utility2024
Photonics Integrated Circuit Package
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US11935836utility2024
Semiconductor Devices
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US11935830utility2024
Integrated Circuit with Frontside and Backside Conductive Layers and Exposed Backside Substrate
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