Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11961796utility2024
Semiconductor Package Dielectric Substrate Including a Trench
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US11961791utility2024
Package Structures and Methods for Forming the Same
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US11961789utility2024
Semiconductor Package and Manufacturing Method Thereof
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US11961811utility2024
Semiconductor Structures and Method of Manufacturing the Same
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US11961777utility2024
Package Structure Comprising Buffer Layer for Reducing Thermal Stress and Method of Forming the Same
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US11961768utility2024
CMOS Finfet Structures Including Work-function Materials Having Different Proportions of Crystalline Orientations and Methods of Forming the Same
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US11961886utility2024
Semiconductor Structure with Conductive Structure
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US11961887utility2024
Semiconductor Device Having Nanosheet Transistor and Methods of Fabrication Thereof
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US11961890utility2024
Semiconductor Device and Method for Manufacturing the Same
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US11961892utility2024
Contacts for Highly Scaled Transistors
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US11961899utility2024
Semiconductor Devices and Methods of Manufacturing Thereof
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US11961911utility2024
Semiconductor Devices Including Channel Regions Having Non-uniform Ge Concentration
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US11961913utility2024
Semiconductor Device Structure and Method for Forming the Same
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US11961915utility2024
Capacitance Reduction for Back-side Power Rail Device
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US11955430utility2024
Method of Manufacturing Semiconductor Device and Semiconductor Devices
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US11951569utility2024
Damage Prevention During Wafer Edge Trimming
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US11952656utility2024
PVD System and Collimator
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US11955401utility2024
Package Structure
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US11953448utility2024
Method for Defect Inspection
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US11953719utility2024
Optical Power Splitter and Method of Manufacturing the Same
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