Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11973110utility2024
Semiconductor Structure and Method of Forming the Same
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US11973101utility2024
Mechanisms for Forming Image-sensor Device with Deep-trench Isolation Structure
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US11973079utility2024
Integration of Multiple Fin Structures on a Single Substrate
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US11973077utility2024
Semiconductor Device and Manufacturing Method Thereof
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US11973076utility2024
Electrostatic Discharge Protection Circuit and Semiconductor Circuit
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US11973075utility2024
Dual Substrate Side ESD Diode for High Speed Circuit
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US11973050utility2024
Method for Forming an Upper Conductive Structure Having Multilayer Stack to Decrease Fabrication Costs and Increase Performance
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US11973040utility2024
Interposer with Warpage-relief Trenches
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US11973038utility2024
Package Structure with Improved Antenna Patterns Performance
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US11969677utility2024
Method of Using Liquid Supply System with Improved Bubble Venting Capacity
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US11970688utility2024
Integrated Cell Monitoring Apparatus and Method of Using the Same
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US11973124utility2024
Method of Manufacturing a Semiconductor Device and a Semiconductor Device
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US11971573utility2024
Multi-layer Waveguide Optical Coupler
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US11971657utility2024
Photoresist Developer and Method of Developing Photoresist
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US11972826utility2024
System and Method for Extending Lifetime of Memory Device
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US11972975utility2024
Semiconductor Device Structure Having Air Gap and Method for Forming the Same
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US11973027utility2024
Semiconductor Device and Methods of Forming the Same
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US11973023utility2024
Stacked via Structure
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US11972982utility2024
Method of Manufacturing a Semiconductor Device
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US11972981utility2024
Finfet Channel on Oxide Structures and Related Methods
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