Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US11996327utility2024
Interconnect Structure and Methods of Forming the Same
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US11996326utility2024
Barrier Structure for Semiconductor Device
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US11996325utility2024
Interconnect Structure of Semiconductor Device
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US11996323utility2024
Semiconductor Device with Source/drain Epitaxial Layer
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US11996333utility2024
Source/drain EPI Structure for Improving Contact Quality
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US11996321utility2024
Semiconductor Structure and Method for Forming the Same
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US11996308utility2024
Method for Mapping Wafers in a Wafer Carrier
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US11996297utility2024
Method of Manufacturing a Semiconductor Device
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US11996461utility2024
Backside Gate Contact
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US11996283utility2024
Method for Metal Gate Surface Clean
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US11996227utility2024
Hexagonal Semiconductor Package Structure
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US11996163utility2024
Bit Line Logic Circuits and Methods
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US11996140utility2024
SRAM Structure with Asymmetric Interconnection
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US11996137utility2024
Compute in Memory (CIM) Memory Array
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US11995388utility2024
Integrated Circuit and Method of Forming Same
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US11993066utility2024
Chuck, Lamination Process, and Manufacturing Method of Semiconductor Package Using the Same
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US11993510utility2024
Composite Spring Structure to Reinforce Mechanical Robustness of a MEMS Device
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US11993512utility2024
Dual Micro-electro Mechanical System and Manufacturing Method Thereof
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US11993854utility2024
Chamber Wall Polymer Protection System and Method
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US11994534utility2024
Testing Device for Integrated Circuit Package
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