Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12002770utility2024
Power Management Semiconductor Package and Manufacturing Method Thereof
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US12002768utility2024
Semiconductor Package and Manufacturing Method Thereof
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US12002767utility2024
Integrated Circuit Package and Method
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US12002766utility2024
Semiconductor Structure Having Isolations Between Fins and Comprising Materials with Different Thermal Expansion Coefficients (CTE)
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US12002761utility2024
Semiconductor Device, Stacked Semiconductor Device and Manufacturing Method of Semiconductor Device
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US12002755utility2024
Metallization Layer and Fabrication Method
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US12002750utility2024
Interconnect Structure
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US12002749utility2024
Barrier and Air-gap Scheme for High Performance Interconnects
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US12002746utility2024
Chip Package Structure with Metal-containing Layer
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US12002721utility2024
Method of Fabricating Semiconductor Structure
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US12002718utility2024
Fin Field-effect Transistor Device and Method
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US12002716utility2024
Method of Manufacturing a Semiconductor Device and a Semiconductor Device
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US12002712utility2024
Phase Control in Contact Formation
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US12002711utility2024
Patterning Methods for Semiconductor Devices and Structures Resulting Therefrom
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US12002709utility2024
Interconnect Structure and Manufacturing Method for the Same
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US12002710utility2024
Semiconductor Structure and Methods of Forming the Same
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US12002684utility2024
Methods for Chemical Mechanical Polishing and Forming Interconnect Structure
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US12002663utility2024
Processing Apparatus and Method for Forming Semiconductor Structure
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US11999027utility2024
Method for Polishing Semiconductor Substrate
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US12000455utility2024
Systems and Methods for Reducing Vibration of Apparatuses
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