- US12027370utility2024Method of Forming an Integrated Circuit Using a Patterned Mask Layer0 cites
- US12027376utility2024Method for Cut Metal Gate Etch Dimensional Control0 cites
- US12027391utility2024Electromigration Evaluation Methodology with Consideration of Thermal and Signal Effects0 cites
- US12027403utility2024Pick-and-place System with a Stabilizer0 cites
- US12027407utility2024Substrate Support Apparatus and Method0 cites
- US12027414utility2024Using a Liner Layer to Enlarge Process Window for a Contact Via0 cites
- US12027420utility2024Etch Stop Layer for Memory Device Formation0 cites
- US12027424utility2024Semiconductor Integrated Circuit0 cites
- US12027433utility2024Semiconductor Package and Method for Making the Same0 cites
- US12027446utility2024Method for Forming a Semiconductor Component with a Cooling Structure0 cites
- US12027447utility2024Semiconductor Device Having a Dual Material Redistribution Line0 cites
- US12027461utility2024Semiconductor Device Including Buried Conductive Fingers and Method of Making the Same0 cites
- US12027465utility2024Impedance Controlled Electrical Interconnection Employing Meta-materials0 cites
- US12027478utility2024Manufacturing Method of Semiconductor Structure0 cites
- US12027494utility2024Semiconductor Device and Manufacturing Method Thereof0 cites
- US12027521utility2024Semiconductor Devices and Methods of Manufacturing Thereof0 cites
- US12027522utility2024Systems and Methods for Fabricating Finfets with Different Threshold Voltages0 cites
- US12021026utility2024Package Structure and Method of Fabricating the Same0 cites
- US12021037utility2024Method for Manufacturing Package Structure0 cites
- US12022664utility2024Magnetic Device Structure and Methods of Forming the Same0 cites