Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12057353utility2024
Measurement Pattern and Method for Measuring Overlay Shift of Bonded Wafers
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US12057358utility2024
Package Structure with Antenna Pattern
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US12057359utility2024
Semiconductor Package and Method of Fabricating the Same
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US12057363utility2024
Chip Package Structure with Multiple Gap-filling Layers and Fabricating Method Thereof
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US12057390utility2024
Source/drain Isolation Structure, Layout, and Method
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US12057392utility2024
Conductive Features Having Varying Resistance
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US12057397utility2024
Capping Layer for Liner-free Conductive Structures
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US12057406utility2024
Package Having Redistribution Layer Structure with Protective Layer
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US12057412utility2024
Device Crack-stop Structure to Prevent Damage Due to Dicing Crack
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US12057415utility2024
Semiconductor Device Having Antenna and Manufacturing Method Thereof
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US12057424utility2024
Package Structure and Method for Forming the Same
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US12057432utility2024
Integrated Fan-out Package Structures with Recesses in Molding Compound
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US12057437utility2024
Package Structure, Chip Structure and Method of Fabricating the Same
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US12057438utility2024
Die Stack Structure and Manufacturing Method Thereof
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US12057439utility2024
Integrated Circuit Packages
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US12057445utility2024
Method of Manufacturing a Semiconductor Device and a Semiconductor Device
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US12057467utility2024
Image Sensor Device and Methods of Forming the Same
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US12057468utility2024
Semiconductor Device with Inductor Windings Around a Core Above an Encapsulated Die
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US12057469utility2024
Semiconductor Device and a Method of Fabricating the Same
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US12057477utility2024
Semiconductor Structure with Hybrid Nanostructures
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