Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12555617utility2026
Bit Line Logic Circuit and Method
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US12557681utility2026
Semiconductor Package and Method of Manufacturing the Same
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US12557687utility2026
Semiconductor Package Device and Method for Manufacturing the Same
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US12557690utility2026
Package Structures
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US12557674utility2026
Package Structure and Method of Fabricating the Same
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US12557661utility2026
Package Structure with Antenna Element
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US12557662utility2026
Manufacturing Method of Semiconductor Structure
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US12557698utility2026
Package and Manufacturing Method Thereof
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US12557666utility2026
Method of Manufacturing Conductive Structure, Method of Manufacturing Redistribution Circuit Structure and Method of Manufacturing Semiconductor Package
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US12557707utility2026
Method of Fabricating Package Structure
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US12557643utility2026
Semiconductor Device Structure and Methods of Forming the Same
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US12557631utility2026
Low-resistance Copper Interconnects
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US12557646utility2026
Multi-die Package and Methods of Formation
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US12557365utility2026
Integrated Circuit Structure and Method for Fabricating the Same
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US12557655utility2026
Passive Device Structure Stress Reduction
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US12557710utility2026
Semiconductor Device, Electronic Device Including the Same, and Manufacturing Method Thereof
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US12557391utility2026
Method for Forming Semiconductor-on-insulator (SOI) Substrate and Recycle Substrate
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US12550619utility2026
Techniques for MRAM MTJ Top Electrode Connection
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US12545810utility2026
Magnetic Polishing Slurry and Method for Polishing a Workpiece
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US12546821utility2026
Electronic Circuit and Method of Error Correction
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