Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12554059utility2026
Waveguide Photodetector and Method for Forming the Same
0 cites
US12557674utility2026
Package Structure and Method of Fabricating the Same
0 cites
US12557681utility2026
Semiconductor Package and Method of Manufacturing the Same
0 cites
US12557687utility2026
Semiconductor Package Device and Method for Manufacturing the Same
0 cites
US12557666utility2026
Method of Manufacturing Conductive Structure, Method of Manufacturing Redistribution Circuit Structure and Method of Manufacturing Semiconductor Package
0 cites
US12557655utility2026
Passive Device Structure Stress Reduction
0 cites
US12557661utility2026
Package Structure with Antenna Element
0 cites
US12557690utility2026
Package Structures
0 cites
US12557662utility2026
Manufacturing Method of Semiconductor Structure
0 cites
US12557631utility2026
Low-resistance Copper Interconnects
0 cites
US12557707utility2026
Method of Fabricating Package Structure
0 cites
US12557629utility2026
Interconnect Structure and Methods of Forming the Same
0 cites
US12557643utility2026
Semiconductor Device Structure and Methods of Forming the Same
0 cites
US12557358utility2026
Nanosheet Semiconductor Device and Method for Manufacturing the Same
0 cites
US12557646utility2026
Multi-die Package and Methods of Formation
0 cites
US12557698utility2026
Package and Manufacturing Method Thereof
0 cites
US12557376utility2026
Semiconductor Device Structure and Methods of Forming the Same
0 cites
US12545810utility2026
Magnetic Polishing Slurry and Method for Polishing a Workpiece
0 cites
US12550619utility2026
Techniques for MRAM MTJ Top Electrode Connection
0 cites
US12546939utility2026
Semiconductor Package and Manufacturing Method Thereof
0 cites

← PreviousPage 22 of 411Next →