Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12087826utility2024
Method for Forming a Semiconductor Structure
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US12087820utility2024
Semiconductor Device Having a Plurality of III-V Semiconductor Layers
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US12087814utility2024
Semiconductor Devices and Methods of Manufacturing Thereof
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US12087811utility2024
Three Dimensional Metal Insulator Metal Capacitor Structure
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US12087809utility2024
Semiconductor Device Having Capacitor and Manufacturing Method Thereof
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US12087801utility2024
Deep Trench Isolations and Methods of Forming the Same
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US12087776utility2024
Semiconductor Device and Manufacturing Method Thereof
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US12087768utility2024
Semiconductor Device Structure and Method for Forming the Same
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US12087755utility2024
Method of Fabricating Package Structure
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US12087745utility2024
Package Structure and Manufacturing Method Thereof
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US12087732utility2024
Isolation Bonding Film for Semiconductor Packages and Methods of Forming the Same
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US12087729utility2024
Multi-chip Package Having Stress Relief Structure
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US12087727utility2024
Joint Structure in Semiconductor Package and Manufacturing Method Thereof
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US12087718utility2024
Bump Structure Having a Side Recess and Semiconductor Structure Including the Same
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US12087715utility2024
Integrated Circuit Features with Obtuse Angles and Method of Forming Same
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US12087709utility2024
Guard Ring and Manufacturing Method Thereof
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US12087705utility2024
Package Structure with Warpage-control Element
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US12087684utility2024
Integrated Circuit Structure of Capacitive Device
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US12087654utility2024
Sensing Die Encapsulated by an Encapsulant with a Roughness Surface Having a Hollow Region
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US12087642utility2024
Selective Dual Silicide Formation
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