Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12125743utility2024
Via-first Process for Connecting a Contact and a Gate Electrode
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US12125741utility2024
Semiconductor Package and Method of Fabricating Semiconductor Package
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US12125727utility2024
Wafer Transfer System and a Method for Transporting Wafers
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US12125715utility2024
Chip Package Structure with Nickel Layer
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US12125706utility2024
Semiconductor Device and Method of Manufacture
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US12125712utility2024
Landing Metal Etch Process for Improved Overlay Control
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US12125548utility2024
Memory Array Test Method and System
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US12125525utility2024
Memory Device and Method of Operating the Same
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US12125523utility2024
Memory Device and Method of Manufacturing the Same
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US12125892utility2024
Transistors with Reduced Defect and Methods of Forming Same
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US12125850utility2024
Buried Metal Track and Methods Forming Same
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US12124785utility2024
Method of Making Cell Regions of Integrated Circuits
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US12124168utility2024
Method and Apparatus for Coating Photoresist Over a Substrate
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US12124119utility2024
Optical Modulator and Package
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US12124083utility2024
Semiconductor Structure with Multi-layers Film
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US12123871utility2024
Biosensor System with Integrated Microneedle
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US12123846utility2024
Wafer-level Packaging of Solid-state Biosensor, Microfluidics, and Through-silicon Via
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US12120968utility2024
Semiconductor Device, Memory Cell Including Connecting Structure Having Base Portion and Pillar Portion, and Method of Forming the Same
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US12120886utility2024
Memory Device and Manufacturing Method Thereof
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US12120884utility2024
Semiconductor Device and Method of Manufacturing the Same
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