- US12154927utility2024Semiconductor Structure0 cites
- US12154903utility2024Fin-based Field Effect Transistors0 cites
- US12154902utility2024Semiconductor Device and Manufacturing Method Thereof0 cites
- US12154897utility2024Package Structures0 cites
- US12154896utility2024Three-dimensional Integrated Circuit Packages and Methods of Forming the Same0 cites
- US12154888utility2024Semiconductor Package and Method of Manufacturing the Same0 cites
- US12154876utility2024Semiconductor Interconnect Structure and Method0 cites
- US12154875utility2024Package and Method of Fabricating the Same0 cites
- US12154869utility2024Semiconductor Package with High Density of Through-silicon Vias (TSV)0 cites
- US12154867utility2024Multiplexer Cell and Semiconductor Device Having Camouflage Design, and Method for Forming Multiplexer Cell0 cites
- US12154862utility2024System and Method for Aligned Stitching0 cites
- US12154851utility2024Method of Forming a Semiconductor Device with Inter-layer Vias0 cites
- US12154850utility2024Semiconductor Interconnection Structures and Methods of Forming the Same0 cites
- US12154849utility2024Capacitor Formed with High Resistance Layer and Method of Manufacturing Same0 cites
- US12154829utility2024Method of Manufacturing Semiconductor Devices and Semiconductor Devices0 cites
- US12154822utility2024Dummy Fin Structures and Methods of Forming Same0 cites
- US12154608utility2024Magnetic Tunnel Junction Device and Method of Forming Same0 cites
- US12153868utility2024Integrated Circuit Having Non-integral Multiple Pitch0 cites
- US12153351utility2024Enhancing Lithography Operation for Manufacturing Semiconductor Devices0 cites
- US12153350utility2024Method of Manufacturing Semiconductor Devices0 cites