Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12166105utility2024
Semiconductor Device Structure with Metal Gate Stacks
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US12166089utility2024
Method of Manufacturing Semiconductor Device and Associated Memory Device
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US12166084utility2024
Semiconductor Device and Manufacturing Method Thereof
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US12166078utility2024
Contact Structure for Semiconductor Device and Method
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US12166075utility2024
Method and Structure for Gate-all-around Devices
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US12166067utility2024
Titanium Layer as Getter Layer for Hydrogen in a MIM Device
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US12166054utility2024
Image Sensor with Passivation Layer for Dark Current Reduction
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US12166048utility2024
Pixel Array Including Octagon Pixel Sensors
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US12166038utility2024
Semiconductor Device and a Method for Fabricating the Same
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US12166037utility2024
Isolation Layers in Stacked Semiconductor Devices
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US12166035utility2024
Finfet with Bowl-shaped Gate Isolation and Method
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US12166034utility2024
Semiconductor Device with CPODE and Related Methods
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US12166029utility2024
Integrated Circuit Device with Power Control Circuit Having Various Transistor Types and Method
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US12166026utility2024
Semiconductor Packages and Methods for Forming the Same
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US12166015utility2024
Semiconductor Package and Manufacturing Method of Semiconductor Package
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US12166014utility2024
Manufacturing Method of Package
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US12166030utility2024
Electrostatic Discharge Protection Device and Method of Making
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US12165990utility2024
Semiconductor Device
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US12165980utility2024
Semiconductor Package and Methods of Manufacturing
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US12165978utility2024
Package Structure and Method of Manufacturing the Same
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