Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12224276utility2025
3D Semiconductor Packages
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US12224265utility2025
Three-dimensional Stacking Structure and Manufacturing Method Thereof
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US12224257utility2025
Semiconductor Structure and Manufacturing Method Thereof
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US12224247utility2025
Fan-out Package Having a Main Die and a Dummy Die
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US12224243utility2025
Semiconductor Memory Device Having Word Lines Surrounded by Memory Layers and Method of Making the Semiconductor Memory Device
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US12224238utility2025
MIM Efuse Memory Devices and Memory Array
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US12224237utility2025
Method of Manufacturing a via and a Metal Wiring for a Semiconductor Device
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US12224224utility2025
Package Structure with Metallic Layer Over the Surfaces of a Plurality of Semiconductor Dies
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US12224209utility2025
Semiconductor Device and Manufacturing Method Thereof
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US12224204utility2025
Semiconductor Device and Method
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US12224028utility2025
Semiconductor Chip and Sequence Checking Circuit
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US12223251utility2025
Standard Cell and Semiconductor Device Including Anchor Nodes
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US12223250utility2025
Method of Manufacturing Integrated Circuit Having Through-substrate Via
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US12223247utility2025
Logic Cell Structures and Related Methods
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US12222653utility2025
Method for Forming Semiconductor Structure
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US12222647utility2025
Photoresist Composition and Method of Forming Photoresist Pattern
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US12222643utility2025
Method of Manufacturing a Semiconductor Device and Pattern Formation Method
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US12222639utility2025
Extreme Ultraviolet Mask and Method of Manufacturing the Same
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US12222542utility2025
Photonic Device on a Semiconductor-on-insulator Substrate and Method of Manufacturing Thereof
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US12218242utility2025
Semiconductor Structure
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