Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12238934utility2025
Method of Fabricating Semiconductor Device Comprising Ferroelectric Layer
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US12238933utility2025
Semiconductor Structures and Methods of Forming the Same
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US12238932utility2025
Ferroelectric Memory Device, Manufacturing Method of the Ferroelectric Memory Device and Semiconductor Chip
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US12238865utility2025
Integrated Circuit Structure
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US12238478utility2025
Top Notch Slit Profile for MEMS Device
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US12237647utility2025
Techniques for Vertical Cavity Surface Emitting Laser Oxidation
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US12237421utility2025
Semiconductor Device Structure and Method for Forming the Same
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US12237416utility2025
Cut-fin Isolation Regions and Method Forming Same
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US12237405utility2025
Semiconductor Devices and Methods of Manufacturing Thereof
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US12237404utility2025
Methods for Increasing Germanium Concentration of Surfaces of a Silicon Germanium Portion of a Fin and Resulting Semiconductor Devices
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US12237390utility2025
Low Resistance Contact Feature
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US12237393utility2025
Method of Fabricating a Semiconductor Device
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US12237375utility2025
Semiconductor Structure of Stacked Two-dimensional Material Layers
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US12237334utility2025
Semiconductor Structure
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US12237323utility2025
Semiconductor Device Having Improved Electrostatic Discharge Protection
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US12237322utility2025
Semiconductor Device Having Fin Structure
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US12237321utility2025
Filler Cell Region with Centrally Uncut Gate Segments, Semiconductor Device Including Same and Method of Manufacturing Same
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US12237320utility2025
Package Structure and Method of Forming the Same
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US12237303utility2025
Vertically Mounted Die Groups
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US12237284utility2025
Semiconductor Structure Comprising Dummy Feature Interposed Between the Bonding Connectors
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