Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12249629utility2025
Field Plate Structure for High Voltage Device
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US12249539utility2025
Multigate Device Structure with Engineered Cladding and Method Making the Same
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US12250829utility2025
Memory Device, and Integrated Circuit Device
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US12250826utility2025
Integrated Circuit Device and Method for Fabricating the Same
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US12250822utility2025
Three-dimensional Memory Device and Manufacturing Method Thereof
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US12249657utility2025
Semiconductor Device
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US12249656utility2025
Transistor, Integrated Circuit, and Manufacturing Method of Transistor
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US12249650utility2025
Finfet Device and Methods of Forming the Same
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US12249636utility2025
Tuning Gate Lengths in Multi-gate Field Effect Transistors
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US12249621utility2025
Semiconductor Structure with Dielectric Fin Feature
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US12249608utility2025
Method for Manufacturing Semiconductor Structure and Semiconductor Structure Thereof
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US12249601utility2025
Integrated Circuit Device, Method, Layout, and System
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US12249590utility2025
Die-group Package Having a Deep Trench Device
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US12249587utility2025
Semiconductor Structure and Forming Method Thereof
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US12249586utility2025
Film Structure for Bond Pad
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US12249581utility2025
Method of Manufacture Overlay Mark Using Laser Marking Process for Semiconductor Device
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US12249580utility2025
Passivation Scheme Design for Wafer Singulation
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US12249568utility2025
Metallization Structure
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US12249564utility2025
Package Structure, RDL Structure Comprising Redistribution Layer Having Ground Plates and Signal Lines
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US12249555utility2025
Semiconductor Device Package Including a Thermal Conductive Layer and Methods of Forming the Same
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