Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12261228utility2025
Semiconductor Device
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US12261218utility2025
Semiconductor Structure and Method of Forming the Same
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US12261213utility2025
Fin-end Gate Structures and Method Forming Same
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US12261222utility2025
Semiconductor Structure and Manufacturing Method Thereof
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US12261203utility2025
Semiconductor Device Structure with Gate Stack and Method for Forming the Same
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US12261199utility2025
Thermoelectric Cooling of Semiconductor Devices
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US12261197utility2025
Diffusion Barrier Layer in Top Electrode to Increase Break Down Voltage
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US12261196utility2025
Metal-insulator-metal Device Capacitance Enhancement
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US12261190utility2025
Vertically Stacked Light Sensors
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US12261188utility2025
Image Sensor Device and Methods of Forming the Same
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US12261175utility2025
Method for Forming Integrated Circuit
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US12261172utility2025
Semiconductor Devices and Methods of Manufacturing Thereof
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US12261167utility2025
Structure and Method of Power Supply Routing in Semiconductor Device
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US12261152utility2025
Vertical Interconnect Structures in Three-dimensional Integrated Circuits
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US12261151utility2025
Integrated Circuit Packages
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US12261142utility2025
Semiconductor Structure Including Thermal Enhanced Bonding Structure
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US12261133utility2025
Interposer with Warpage-relief Trenches
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US12261126utility2025
Semiconductor Package
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US12261125utility2025
Method for Forming Chip Package Structure
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US12261121utility2025
Structure and Method for a Low-k Dielectric with Pillar-type Air-gaps
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