- US12272733utility2025Transistor Device for Source/drain Backside Contact and Method of Forming Cavity0 cites
- US12272732utility2025Method for Forming Epitaxial Source/drain Features and Semiconductor Devices Fabricated Thereof0 cites
- US12272756utility2025Semiconductor Device0 cites
- US12272731utility2025Middle-of-line Interconnect Structure and Manufacturing Method0 cites
- US12272729utility2025Asymmetric Source/drain for Backside Source Contact0 cites
- US12272726utility2025Semiconductor Structure with Nanostructure0 cites
- US12272716utility2025Capping Structure to Reduce Dark Current in Image Sensors0 cites
- US12272715utility2025High Reflectance Isolation Structure to Increase Image Sensor Performance0 cites
- US12272691utility2025Semiconductor and Circuit Structures, and Related Methods0 cites
- US12272686utility2025Semiconductor Structure and Manufacturing Method of the Same0 cites
- US12272674utility2025Stacking Structure, Package Structure and Method of Fabricating the Same0 cites
- US12272670utility2025Integrated Semiconductor Packaging System with Enhanced Dielectric-to-dielectric Bonding Quality0 cites
- US12272664utility2025Semiconductor Packages Having Conductive Pillars with Inclined Surfaces0 cites
- US12272663utility2025Metal-bump Sidewall Protection0 cites
- US12272649utility2025Semiconductor Device and Method0 cites
- US12272623utility2025Semiconductor Packages and Methods for Forming the Same0 cites
- US12272622utility2025Package and Manufacturing Method Thereof0 cites
- US12272621utility2025Buried Conductive Structure in Semiconductor Substrate0 cites
- US12272612utility2025Semiconductor Package Module and Manufacturing Methods Thereof0 cites
- US12272603utility2025Method of Manufacturing a Semiconductor Device and a Semiconductor Device0 cites