Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12300741utility2025
Semiconductor Device and Method
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US12300660utility2025
Method of Forming a Bonded Semiconductor Structure
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US12300659utility2025
Aligning Bumps in Fan-out Packaging Process
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US12300652utility2025
Substrate and Package Structure
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US12300640utility2025
Semiconductor Device and Method of Manufacturing Thereof
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US12300636utility2025
Seal Ring Structure and Method of Fabricating the Same
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US12300635utility2025
Semiconductor Device Having Functional Patterns in Redundant Regions of Double Seal Ring
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US12300632utility2025
Chip Package with Lid
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US12300611utility2025
Interconnect Conductive Structure Comprising Two Conductive Materials
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US12300609utility2025
Two-dimensional (2D) Metal Structure and Method of Forming the Same
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US12300608utility2025
Method of Manufacturing Semiconductor Device
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US12300605utility2025
Reducing Internal Node Loading in Combination Circuits
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US12300603utility2025
Modified Fuse Structure and Method of Use
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US12300601utility2025
Interconnect Structure
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US12300600utility2025
Semiconductor Device with Self-aligned Conductive Features
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US12300599utility2025
Method for Forming Semiconductor Structure
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US12300598utility2025
Package Structure and Method of Fabricating the Same
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US12300593utility2025
Semiconductor Device and Method of Manufacture
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US12300592utility2025
Fan-out Package with Controllable Standoff
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US12300574utility2025
Adhesive and Thermal Interface Material on a Plurality of Dies Covered by a Lid
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