Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

8,208 patents in portfolio

US12315843utility2025
Hybrid Bonding Technology for Stacking Integrated Circuits
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US12315837utility2025
Storage Layers for Wafer Bonding
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US12315864utility2025
Method of Manufacturing a Semiconductor Device and a Semiconductor Device
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US12315819utility2025
Method of Forming Rdls and Structure Formed Thereof
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US12315817utility2025
Dielectric on Wire Structure to Increase Processing Window for Overlying Via
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US12315806utility2025
Electronic Device and Manufacturing Method Thereof
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US12315791utility2025
Metal-insulator-metal Capacitor Within Metallization Structure
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US12315786utility2025
Semiconductor Structure and Manufacturing Method Thereof
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US12315784utility2025
Semiconductor Package and Manufacturing Method Thereof
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US12315730utility2025
Semiconductor Devices with Metal Intercalated High-k Capping
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US12315562utility2025
RRAM Circuit and Method
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US12315560utility2025
Integrated Circuit Device and Manufacturing Method of the Same
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US12315561utility2025
Semiconductor Memory Devices with Different Word Lines
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US12315863utility2025
Contact Structures in Semiconductor Devices
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US12314650utility2025
Integrated Circuit Device and Manufacturing Method of the Same
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US12313879utility2025
Semiconductor Device, Photonic Circuit and Method for Adjusting Resonant Wavelength of Optical Modulator
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US12313675utility2025
Method and Device for Wafer-level Testing
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US12311498utility2025
Monolithic Platen
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US12316828utility2025
Automatic Time Delay and Integration (TDI) Mask Inspection System Calibration
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US12317552utility2025
Semiconductor Device Structure and Method for Forming the Same
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