- US12100730utility2024Metal-insulator-metal Capacitors with Thick Intermediate Electrode Layers and Methods of Forming the Same0 cites
- US12094925utility2024Three-dimensional Device Structure Including Embedded Integrated Passive Device and Methods of Making the Same0 cites
- US12094756utility2024Semiconductor Arrangement Comprising Isolation Structure Comprising at Least Two Electrical Insulator Layers0 cites
- US12094868utility2024Shielded Deep Trench Capacitor Structure and Methods of Forming the Same0 cites
- US12094957utility2024Semiconductor Devices and Methods of Manufacturing Thereof0 cites
- US12087777utility2024Systems and Methods for a Semiconductor Structure Having Multiple Semiconductor-device Layers0 cites
- US12087690utility2024Integrated Circuit Having a High Cell Density0 cites
- US12087756utility2024Protective Wafer Grooving Structure for Wafer Thinning and Methods of Using the Same0 cites
- US12088940utility2024Semiconductor Device and Method of Manufacture0 cites
- US12078607utility2024Wide-bandgap Semiconductor Layer Characterization0 cites
- US12078554utility2024Temperature Protection Circuit0 cites
- US12080594utility2024Thermally Stable Copper-alloy Adhesion Layer for Metal Interconnect Structures and Methods for Forming the Same0 cites
- US12075633utility2024Vertical Metal Oxide Semiconductor Channel Selector Transistor and Methods of Forming the Same0 cites
- US12071701utility2024Plating System and Method of Plating Wafer0 cites
- US12074059utility2024Semiconductor Arrangement and Method of Making0 cites
- US12074219utility2024Back Channel Field Effect Transistors Using a Pull Back Process and Methods for Forming the Same0 cites
- US12074220utility2024Formation of Semiconductor Arrangement Comprising Semiconductor Column0 cites
- US12075636utility2024Threshold Voltage-modulated Memory Device Using Variable-capacitance and Methods of Forming the Same0 cites
- US12068313utility2024Semiconductor Arrangement and Formation Thereof0 cites