Patents/Assignees

TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

3,601 patents in portfolio

US11955442utility2024
Semiconductor Package and Method
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US11955441utility2024
Interconnect Structure and Forming Method Thereof
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US11955455utility2024
Embedded Stress Absorber in Package
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US11950433utility2024
Resistive Random Access Memory Device
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US11948936utility2024
Forming ESD Devices Using Multi-gate Compatible Processess
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US11948972utility2024
High-voltage Nano-sheet Transistor
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US11948970utility2024
Semiconductor Device and Manufacturing Method Thereof
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US11948940utility2024
Multi-gate Device Structure
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US11948835utility2024
Interconnection Structure with Anti-adhesion Layer
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US11948839utility2024
Power Reduction in Finfet Structures
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US11948840utility2024
Protective Layer Over Finfet and Method of Forming Same
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US11948842utility2024
Etch Stop Layer Between Substrate and Isolation Structure
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US11948918utility2024
Redistribution Structure for Semiconductor Device and Method of Forming Same
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US11948926utility2024
Integrated Circuit Package and Method
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US11948930utility2024
Semiconductor Package and Method of Manufacturing the Same
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US11948974utility2024
Semiconductor Device Including Vertical Transistor with Back Side Power Structure
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US11948981utility2024
Seam-filling of Metal Gates with Si-containing Layers
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US11948987utility2024
Self-aligned Backside Source Contact Structure
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US11948988utility2024
Source/drain Structure for Semiconductor Device
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US11948989utility2024
Gate-all-around Device with Protective Dielectric Layer and Method of Forming the Same
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