- US11927443utility2024Temporal Differential Sensing Structure for Vibrating Gyroscope0 cites
- US11929259utility2024Method for Manufacturing Leadless Semiconductor Package with Wettable Flanks0 cites
- US11921655utility2024Dynamic Memory Protection Device System and Method0 cites
- US11916090utility2024Tapeless Leadframe Package with Exposed Integrated Circuit Die0 cites
- US11897763utility2024Capless Semiconductor Package with a Micro-electromechanical System (MEMS)0 cites
- US11862579utility2024Semiconductor Device Having Cavities at an Interface of an Encapsulant and a Die Pad or Leads0 cites
- US11856657utility2023Closed Loop Temperature Controlled Circuit to Improve Device Stability0 cites
- US11848256utility2023Semiconductor Package Having Die Pad with Cooling Fins0 cites
- US11815568utility2023System and Method for Fast Magnetometer Calibration Using Gyroscope0 cites
- US11808063utility2023Door Unlock Mechanism0 cites
- US11727719utility2023System and Method for Detecting Human Presence Based on Depth Sensing and Inertial Measurement0 cites
- US11719540utility2023MEMS Gyroscope Self-test Using a Technique for Deflection of the Sensing Mobile Mass0 cites
- US11720170utility2023Method, Device, and System of Measuring Eye Convergence Angle0 cites
- US11715677utility2023Semiconductor Device with Frame Having Arms0 cites
- US11716317utility2023Method to Prevent Cloning of Electronic Components Using Public Key Infrastructure Secure Hardware Device0 cites
- US11705458utility2023Integrated Circuit Devices and Fabrication Techniques0 cites
- US11699667utility2023Leadframe with Pad Anchoring Members and Method of Forming the Same0 cites
- US11699757utility2023High Dose Implantation for Ultrathin Semiconductor-on-insulator Substrates0 cites
- US11695053utility2023Atomic Layer Deposition of Selected Molecular Clusters0 cites
- US11688715utility2023Semiconductor Die with Multiple Contact Pads Electrically Coupled to a Lead of a Lead Frame0 cites