Patents/Assignees

STATS Chippac, Ltd.

3 patents in portfolio

US8343809utility2013
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die
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US8343810utility2013
Semiconductor Device and Method of Forming Fo-wlcsp Having Conductive Layers and Conductive Vias Separated by Polymer Layers
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US8344495utility2013
Integrated Circuit Packaging System with Interconnect and Method of Manufacture Thereof
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