Patents/Assignees

SJ Semiconductor(jiangyin) Corporation

29 patents in portfolio

US11756871utility2023
Fan-out Packaging Structure and Method
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US11756942utility2023
Fan-out Packaging Structure and Method
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US11749657utility2023
Fan-out Packaging Structure and Method
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US11735554utility2023
Wafer-level Chip Scale Packaging Structure Having a Rewiring Layer and Method for Manufacturing the Wafer-level Chip Scale Packaging Structure
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US11735564utility2023
Three-dimensional Chip Packaging Structure and Method Thereof
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US11728158utility2023
Semiconductor Structure and Method for Preparing the Same
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US11699840utility2023
Antenna Package Structure and Antenna Packaging Method
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US11652085utility2023
Fan-out Wafer-level Packaging Structure and Method Packaging the Same
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US11605604utility2023
Fan-out Antenna Packaging Structure and Packaging Method
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