Patents/Assignees

SHOWA DENKO MATERIALS CO., Ltd.

16 patents in portfolio

US12049538utility2024
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product and Composite Material
0 cites
US11667817utility2023
Electroconductive Film, Roll, Connected Structure, and Process for Producing Connected Structure
0 cites
US11624016utility2023
Moisture-curable Reactive Hot-melt Adhesive Composition and Method for Producing the Same
0 cites
US11608455utility2023
Adhesive for Semiconductor Device, and High Productivity Method for Manufacturing Said Device
0 cites
US11605818utility2023
Anode Material for Lithium Ion Secondary Battery, Method of Producing Anode Material for Lithium Ion Secondary Battery, Anode for Lithium Ion Secondary Battery, and Lithium Ion Secondary Battery
0 cites
US11584868utility2023
Polishing Liquid and Polishing Method
0 cites
US11578236utility2023
Slurry, Polishing-liquid Set, Polishing Liquid, and Polishing Method for Base
0 cites
US11581212utility2023
Prepreg for Coreless Substrate, Coreless Substrate and Semiconductor Package
0 cites
US11572490utility2023
Polishing Liquid, Polishing Liquid Set, and Polishing Method
0 cites
US11575076utility2023
Method for Manufacturing Thermoelectric Conversion Module, Thermoelectric Conversion Module, and Binder for Thermoelectric Conversion Module
0 cites
US11566150utility2023
Slurry and Polishing Method
0 cites
US11560476utility2023
Epoxy Resin, Epoxy Resin Composition, Epoxy Resin Cured Product, and Composite Material
0 cites
US11562951utility2023
Organic Interposer and Method for Manufacturing Organic Interposer
0 cites
US11553593utility2023
Resin Film for Interlayer Insulating Layer with Support, Multilayer Printed Circuit Board, and Method of Manufacturing Multilayer Printed Circuit Board
0 cites
US11542192utility2023
Sealing Material and Multilayered Glass Panel Using Same
0 cites
US11545413utility2023
Thermal Conduction Sheet and Heat Dissipating Device Including Thermal Conduction Sheet
0 cites