Patents/Assignees

SHENGYI TECHNOLOGY CO., Ltd.

16 patents in portfolio

US12466937utility2025
Resin Composition and Use Thereof
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US12378386utility2025
Resin Composition and Application Thereof
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US12234318utility2025
Thermosetting Epoxy Resin Composition and Prepreg, Laminated Board and Printed Circuit Board Using Thermosetting Epoxy Resin Composition
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US12234325utility2025
Resin Composition, Prepreg, Laminate, Metal Foil-clad Laminate, and Printed Circuit Board
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US12187887utility2025
Resin Composition, Prepreg, Laminate and Metal Foil-clad Laminate
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US12122904utility2024
Thermosetting Resin Composition and Prepreg, Laminate and Printed Circuit Board Using Same
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US12104054utility2024
Resin Composition, Prepreg Containing Same, Laminate, and Printed Circuit Board
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US11975507utility2024
Thermosetting Resin Composition, Prepreg Containing Same, Metal Foil-clad Laminate and Printed Circuit Board
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US11970591utility2024
Resin Composition, Prepreg for Printed Circuit and Metal-coated Laminate
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US11945924utility2024
Fluorine-containing Resin Composition, and Resin Vanish, Fluorine-containing Dielectric Sheet, Laminate, Copper Clad Laminate and Printed Circuit Board Containing the Same
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US11930595utility2024
Circuit Material and Circuit Board Containing the Same
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US11744013utility2023
Composite, High-frequency Circuit Substrate Prepared Therefrom and Process for Preparing the Same
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US11732123utility2023
Thermosetting Resin Composition, and Prepreg, Laminate and Printed Circuit Board Using Same
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US11661378utility2023
Boron Nitride Agglomerate, Thermosetting Resin Composition Containing Same, and Use Thereof
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US11649351utility2023
Resin Composition for a Metal Substrate, and Resin Varnish and Metal Base Copper-clad Laminate Comprising the Same
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US11584851utility2023
Resin Composition, and Prepreg and Circuit Material Using the Same
0 cites