- US11881398utility2024Semiconductor Device and Method for Supporting Ultra-thin Semiconductor Die0 cites
- US11880642utility2024Systems and Methods for Designing a Discrete Device Product0 cites
- US11881492utility2024Transistor Structures0 cites
- US11882406utility2024Low-latency Communication Protocol for Binaural Applications0 cites
- US11881857utility2024Gate Driver with Temperature Monitoring Features0 cites
- US11877077utility2024Image Sensor with Black Level Correction0 cites
- US11876109utility2024Semiconductor Devices with Single-photon Avalanche Diodes and Light Spreading Lenses0 cites
- US11876108utility2024Semiconductor Packages with an Array of Single-photon Avalanche Diodes Split Between Multiple Semiconductor Dice0 cites
- US11876954utility2024Stitched Integrated Circuit Dies0 cites
- US11876018utility2024Self-aligned Trench MOSFET Contacts Having Widths Less Than Minimum Lithography Limits0 cites
- US11869868utility2024Multi-segment Wire-bond0 cites
- US11870244utility2024Common-mode Transient Immunity (CMTI) Circuit and Method of Operation Therefor0 cites
- US11870000utility2024Semiconductor Packages with Single-photon Avalanche Diodes and Prisms0 cites
- US11869912utility2024Method for Defining a Gap Height Within an Image Sensor Package0 cites
- US11867730utility2024Adjustable Low Current in a Sensor Network0 cites
- US11863064utility2024Non-regulated Power Converter with Current Sharing Control0 cites
- US11854889utility2023Die Cleaning Systems and Related Methods0 cites
- US11853243utility2023Capacitively-coupled Multi-domain Distributed Driver0 cites
- US11854995utility2023Supports for Thinned Semiconductor Substrates and Related Methods0 cites
- US11848320utility2023Power Module Package for Direct Cooling Multiple Power Modules0 cites