Patents/Assignees

Powertech Technology Inc.

31 patents in portfolio

US11670611utility2023
Semiconductor Package Comprising Plurality of Bumps and Fabricating Method
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US11670622utility2023
Stacked Semiconductor Package and Packaging Method Thereof
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US11658046utility2023
Semiconductor Packaging Structure with Back-deposited Shielding Layer and Manufacturing Method Thereof
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US11658084utility2023
Semiconductor Packaging Structure
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US11637071utility2023
Package Structure Including Multiple Dies Surrounded by Conductive Element and Manufacturing Method Thereof
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US11608205utility2023
Head of a Tag Device
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US11587808utility2023
Chip Carrier Device
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US11569210utility2023
Package Structure Having a First Connection Circuit and Manufacturing Method Thereof
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US11557533utility2023
Package Structure and Manufacturing Method Thereof
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US11545423utility2023
Package Structure and Manufacturing Method Thereof
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US11545424utility2023
Package Structure and Manufacturing Method Thereof
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