Patents/Assignees

NIPPON MICROMETAL CORPORATION

6 patents in portfolio

US12290883utility2025
Bonding Wire
0 cites
US12166006utility2024
Bonding Wire for Semiconductor Devices
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US12157189utility2024
Junction Structure, Method for Manufacturing Junction Structure, and Solder Ball
0 cites
US11929343utility2024
Bonding Wire for Semiconductor Devices
0 cites
US11721660utility2023
Bonding Wire for Semiconductor Devices
0 cites
US11612966utility2023
Ag Alloy Bonding Wire for Semiconductor Device
0 cites