Patents/Assignees

NEPES CO., Ltd.

6 patents in portfolio

US12614850utility2026
Semiconductor Package Including Antenna and Method of Manufacturing the Semiconductor Package
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US12494421utility2025
Semiconductor Package Including Redistribution Structure, and Method of Manufacturing the Same
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US12205904utility2025
Wafer-level Design and Wiring Pattern for a Semiconductor Package
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US12198997utility2025
Semiconductor Package Comprising First Molding Layer and Second Molding Layer with Different Thermal Expansion Coefficients
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US11948891utility2024
Semiconductor Package and Manufacturing Method Thereof
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US11545451utility2023
Semiconductor Package
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