Patents/Assignees

MITSUBISHI MATERIALS CORPORATION

111 patents in portfolio

US11801556utility2023
Metal Particle Aggregates, Method for Producing Same, Paste-like Metal Particle Aggregate Composition, and Method for Producing Bonded Body Using Said Paste-like Metal Particle Aggregate Composition
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US11795525utility2023
Copper Alloy Plate, Copper Alloy Plate with Plating Film, and Manufacturing Method Thereof
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US11796725utility2023
Metal Oxide Microparticles, Method for Producing Same, Dispersion for Forming Infrared-shielding Film, Method for Producing Same, Method for Forming Infrared-shielding Film, and Base Material Having Infrared-shielding Film
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US11798856utility2023
Ceramic/aluminum Bonded Body, Insulating Substrate, LED Module, Ceramic Member, Method for Producing Ceramic/aluminum Bonded Body, and Method for Producing Insulating Substrate
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US11788173utility2023
Free-cutting Copper Alloy, and Manufacturing Method of Free-cutting Copper Alloy
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US11781234utility2023
Copper Alloy Plate, Plating Film-attached Copper Alloy Plate, and Methods Respectively for Manufacturing These Products
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US11761109utility2023
Terminal Material for Connector
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US11763967utility2023
Method of Manufacturing Thermistor
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US11753733utility2023
Method for Producing High-purity Electrolytic Copper
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US11732329utility2023
Copper Alloy, Copper Alloy Plastic-processed Material, Component for Electronic and Electric Devices, Terminal, Bus Bar, and Heat-diffusing Substrate
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US11735434utility2023
Method for Producing Insulating Circuit Substrate with Heat Sink
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US11725258utility2023
Copper Alloy for Electronic/electrical Devices, Copper Alloy Planar Bar Stock for Electronic/electrical Devices, Component for Electronic/electrical Devices, Terminal and Bus Bar
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US11721923utility2023
Terminal Material for Connectors
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US11692277utility2023
High-concentration Tin Sulfonate Aqueous Solution and Method for Producing Same
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US11676882utility2023
Method of Manufacturing Power Module Substrate Board and Ceramic-copper Bonded Body
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US11666966utility2023
Powder Molding Press Method of Green Compact for Cutting Insert, and Powder Molding Press Device
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US11661667utility2023
Anti-corrosion Terminal Material, Anti-corrosion Terminal and Electric Wire End Structure
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US11655523utility2023
Copper Alloy for Electronic/electric Device, Copper Alloy Sheet/strip Material for Electronic/electric Device, Component for Electronic/electric Device, Terminal, and Busbar
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US11647674utility2023
Thermoelectric Conversion Material, Thermoelectric Conversion Element, Thermoelectric Conversion Module, and Method for Manufacturing Thermoelectric Conversion Material
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US11638350utility2023
Copper/ceramic Bonded Body, Insulating Circuit Board, Method for Producing Copper/ceramic Bonded Body, and Method for Producing Insulating Circuit Board
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